| Technical&Capabilities | |||
| Reference | Mass Production | Sample | R&D |
|---|---|---|---|
| Layer | 18 | 24 | 28 |
| Min. Inner Layer Pad size（single） | 5mil（0.13mm） | 4.5mil（0.11mm） | 4.0mil（0.10mm） |
| Board thickness | 0.5-3.2mm | 0.4-3.2mm | 0.3-4.0mm |
| Min. Trace/Space | Inner Layer ：2.5mil/2.5mil Outer Layer ：3.0mil/3.0mil |
Inner Layer ：2.0mil/2.0mil Outer Layer ：2.5mil/2.5mil |
Inner Layer ：2.0mil/2.0mil Outer Layer ：2.5mil/2.5mil |
| Min.Drilled Hole Size-Mechanical | 0.15mm | 0.15mm | 0.10mm |
| Min.Drilled Hole Size-Laser | 0.10mm | 0.075mm | 00.075mm |
| Aspect Ratio | 10:01:00 | 12:01:00 | 13:01:00 |
| Min.Solder Dam | 3.0mil（75μm） | 2.5mil（64μm） | 2.0mil（50μm） |
| Min. Solder open | 2mil | 1.5mil | 1.5mil |
| Max.Soldermask Hole Size | 0.50mm | 0.60mm | 0.80mm |
| Min. Space from hole to trace | 6mil（0.15mm） | 5.5mil（0.14mm） | 5.5mil（0.14mm） |
| Impedance control Tolerance | ±10% | ±8% | ±5% |
| HDI Stackup | ‘+2 stackup | ‘+3 stackup | ‘+4 stackup |
| Surface Treatment | ENIG、HASL、OSP、Immersion Tin | ENIG、HASL、OSP、Immersion Tin | ENIG、HASL、OSP、Immersion Tin |
Reasonable product price
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